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QSil 562


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TDS
SDS
Description
Addition Cure Potting Material
Feature
  • No solvent added
  • Fast curing
  • Low modulus / Good elongation
  • Repairable
Code
QSil 562
Feature
Feature 1
No solvent added
Feature 2
Fast curing
Feature 3
Low modulus / Good elongation
Feature 4
Repairable
Color
Gray
Color A
Dark Gray
Color B
Beige
Cure Type
Addition
Dielectric Constant
3.50
Dissipation Factor
0.002
Elongation at Break
100 %
Gel Time at 25°C/77°F
4 hr
Hardness Shore A
60
Max Storage Temperature
38 °C
Max Working Temp
240 °C
Min Working Temp
-55 °C
Mix Ratio By Weight
1:1
Relative Thermal Index
150 ºC
Rheology
Liquid
RTV or Heat cure
RTV
Shelf Life
24 mths
Solids Content (%)
100 %
Specific Gravity A
1.60
Specific Gravity B
1.60
Tear Resistance (N/mm)
3.50 N/mm
Tensile Strength
1.72 N/mm2
Test Conditions
Cured 15 minutes at 150C and tested at room temperature.
Thermal Conductivity
~0.62 W/mK
UL 94V-0
3.0 mm
UL File No.
E205830
UL Listed
yes
Viscosity A
6,000 cP
Viscosity B
4,500 cP
Viscosity Mixed
5,000 cP
Volume Resistivity (Ohms cm)
1.0E+15 ohms cm
Work life at 25°C to Double Initial Viscosity
90 min
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